Equipment suppliers form alliance to provide one-stop services
Monica Chen, Taipei; Adam Hwang, DIGITIMES
Equipment suppliers C Sun Mfg, Gallant Precision Machining and Gallant Micro Machining have formed an alliance, combining their business capabilities to provide one-stop solutions and services for IC foundry and backend houses, according to industry sources.
The G2C alliance has already obtained orders from IC packaging and testing service providers Advanced Semiconductor Engineering (ASE) and Powertech Technology, the sources said, adding that G2C has set up a service center in Kaohsiung, southern Taiwan, specifically for ASE.
Taiwan Semiconductor Manufacturing Company (TSMC) has adopted wafer-level ovens, AOI (automated optical inspection) pick & place machines and automated carrying equipment supplied by G2C for its IC packaging plant in northern Taiwan, the sources noted, and as TSMC is constructing two advanced IC packaging plants, G2C is poised to compete for more TSMC’s orders in 2021.
Gallant obtained a licensed for using IBM’s PICA (pico-second imaging circuit analysis) technology four years ago and has developed a PICA instrument which will be trialed at TSMC’s plants, the sources indicated.